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  • 3M™ Test & Burn-In SOIC Sockets
  • 3M™ Test & Burn-In SOIC Sockets

    3M ID ISDM2TS0338
    • Lid can be actuated from top or front and is compatible with automated load/unload equipment
    • Compact envelope and side to side stackability maximize board density
    • Tweezer slot for easy manual loading/unloading
    • Lid applies 80 grams normal force per lead for maximum electrical reliability
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    Details

    Compact envelope w/ tweezer slot for easy loading

    • Lid can be actuated from top or front and is compatible with automated load/unload equipment
    • Compact envelope and side to side stackability maximize board density
    • Tweezer slot for easy manual loading/unloading
    • Lid applies 80 grams normal force per lead for maximum electrical reliability
    • Accepts Gull Wing JEDEC device sizes in .150" (3.81 mm) and .300" (7.62 mm) body widths
    • For more Information refer to Data Sheet TS0338 (TS-0338)
    Specifications
    Total Recycled Content %
    C
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