- Features a 70 minute work life
- Rigid potting compound is non-corrosive to copper
- Minimal exotherm and very low shrinkage
- Flammability testing per UL94 HB
Details
3M™ Scotch-Weld™ Epoxy Potting Compound DP270 is low viscosity for easy dispensing and potting. It is non-corrosive to copper, minimal exotherm and very low shrinkage – making it well-suited for potting and bonding electronic and electrical components.
Low viscosity for easy dispensing and potting
Our 3M™ Scotch-Weld™ Epoxy Potting Compound DP270 is a rigid, two-part epoxy adhesive with a 1:1 mix ratio and 70 minute work life. It provides initial strength in about 3 hours with approximately 2,500 PSI at 72°F (22°C). Additionally, our 3M™ Scotch-Weld™ Epoxy Potting Compound DP270 is low viscosity for easy dispensing and potting; and is non-corrosive to copper. It offers good resistance to medical sterilization and is available in black opaque and transparent amber.
Recommended Applications
- Potting and bonding electrical components
Epoxy adhesives are part of the class of adhesives called "structural adhesives," which include polyurethan
- Features a 70 minute work life
- Rigid potting compound is non-corrosive to copper
- Minimal exotherm and very low shrinkage
- Flammability testing per UL94 HB
Specifications
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|---|---|
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Adhesive Type
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Epoxy
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Application Temperature From (Celsius)
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-55 Degree Celsius
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Application Temperature To (Celsius)
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80 Degree Celsius
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Brand
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Scotch-Weld™
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Flame Retardant
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UL94 HB
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Full Cure
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48 Hours @ 72 F (22 C)
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Hardness
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83 Shore D
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Indoor/Outdoor
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Both
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Industries
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Construction, Consumer Goods, Electronics, General Industrial, Military and Government, Specialty Vehicle, Transportation
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Open Time
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60 min @ 72 °F (22 °C)
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Physical Form
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Paste
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Product Form
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Each, Kit
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Product Type
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Epoxy Adhesive
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Shear Strength at 72 Degrees F (22 Degrees C)
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2500 psi
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Shelf Life in Months (from date of manufacture)
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24
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Storage Temperature
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72 Degree Fahrenheit
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Substrate 1
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Metal
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Substrate 2
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Metal
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Viscosity
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Self-leveling
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Volume (metric)
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400 mL
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Work Time
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60 min
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